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What is High Frequency (HF) PCB?

Electronic devices with high frequency are the developing tendency nowadays, especially in the wireless networks. Satellite communication growing rapidly, information products move towards high speed and high frequency. Thus developing new products always need to use high frequency substrate, satellite system, mobile telephone receiving base station and so on, these communication products must use high frequency PCB.

Check Leadsintec High Frequency PCB Manufacturing Capabilities in the Following Table:

Leadsintec HF PCB Capabilities

Leadsintec has deep engineering capabilities and experience with control depth drilling, control depth milling, and back drilling, unlike some of our competitors. This means we have the technology, the experience, and the knowledge to help you design and build the right high frequency PCB from the start.

We differentiate ourselves by being able to take on all complex jobs — all the way from layout through assembly — and we do this under one roof with state-of-the-art technology and an extensive engineering team. This end-to-end expertise allows us to excel at the entire process and be the best PCB provider in the country.

Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services.

Owing to the past over 15 years of rich experience in manufacturing, Leadsintec has gained a fine reputation at home and abroad. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense & Aerospace, Medical and Security markets.

Our commitment is to assist small and mid-sized customers in reducing their costs by providing total solutions, high-mixed, low, and medium volume services. With our skilled program managers, process engineers, production personnel, and procurement professionals, we are capable to fully understand and surpass your requirements.

Leadsintec’s manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion, and finished product fabrication, test, and packing.